| 型号 |
MAX1653EEE+T |
MAX1653EEE |
| 描述 |
Switching Controllers PWM Step-Down |
Switching Controllers PWM Step-Down |
| 是否无铅 |
不含铅 |
含铅 |
| 是否Rohs认证 |
符合 |
不符合 |
| 厂商名称 |
Maxim(美信半导体) |
Maxim(美信半导体) |
| 零件包装代码 |
SOIC |
SOIC |
| 包装说明 |
SSOP, SSOP16,.25 |
0.150 INCH, 0.025 INCH PITCH, QSOP-16 |
| 针数 |
16 |
16 |
| Reach Compliance Code |
compliant |
not_compliant |
| ECCN代码 |
EAR99 |
EAR99 |
| 其他特性 |
PFM CONTROL TECHNIQUE IS ALSO POSSIBLEPFM CONTROL TECHNIQUE IS ALSO POSSIBLE |
PFM CONTROL TECHNIQUE IS ALSO POSSIBLEPFM CONTROL TECHNIQUE IS ALSO POSSIBLE |
| 模拟集成电路 - 其他类型 |
SWITCHING CONTROLLER |
SWITCHING CONTROLLER |
| 控制模式 |
CURRENT-MODE |
CURRENT-MODE |
| 控制技术 |
PULSE WIDTH MODULATION |
PULSE WIDTH MODULATION |
| 最大输入电压 |
30 V |
30 V |
| 最小输入电压 |
4.5 V |
4.5 V |
| 标称输入电压 |
15 V |
15 V |
| JESD-30 代码 |
R-PDSO-G16 |
R-PDSO-G16 |
| JESD-609代码 |
e3 |
e0 |
| 长度 |
4.89 mm |
4.89 mm |
| 湿度敏感等级 |
1 |
1 |
| 功能数量 |
1 |
1 |
| 端子数量 |
16 |
16 |
| 最高工作温度 |
85 °C |
85 °C |
| 最低工作温度 |
-40 °C |
-40 °C |
| 封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
| 封装代码 |
SSOP |
SSOP |
| 封装等效代码 |
SSOP16,.25 |
SSOP16,.25 |
| 封装形状 |
RECTANGULAR |
RECTANGULAR |
| 封装形式 |
SMALL OUTLINE, SHRINK PITCH |
SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度(摄氏度) |
260 |
245 |
| 认证状态 |
Not Qualified |
Not Qualified |
| 座面最大高度 |
1.73 mm |
1.73 mm |
| 表面贴装 |
YES |
YES |
| 切换器配置 |
PUSH-PULL |
PUSH-PULL |
| 最大切换频率 |
350 kHz |
350 kHz |
| 技术 |
BICMOS |
BICMOS |
| 温度等级 |
INDUSTRIAL |
INDUSTRIAL |
| 端子面层 |
Matte Tin (Sn) |
Tin/Lead (Sn85Pb15) |
| 端子形式 |
GULL WING |
GULL WING |
| 端子节距 |
0.635 mm |
0.635 mm |
| 端子位置 |
DUAL |
DUAL |
| 处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
| 宽度 |
3.9 mm |
3.9 mm |